INSTANT BOND DISPENSING SYSTEM 
 Characteristics: 
 - The system introduces the the BUFFER concept, productive maximize the location specified in the PCB or the LEAD the FRAME automatically spit out the liquid system; 
 - High-speed point coating and wire coating product (PALLET functions) 
 - Touch the menu easy to operate, based on the excellent stability of the PLC control equipment; 
 - For JETTING, ROUTING, MOUNTING, SOLDING, SPRAY such as a variety of dispensing mode; 
 - TRAY TYPE robot mode, and can increase the operating capacity of the product.