BGA UNDERFILL 
 Characteristics: 
 - The spit quantitative way to install the BGA (BALL, the GRID ARRAY) chip on the PCB RLVKS UNDERFILL the liquid robot equipment 
 - Heating (CONDITIONING) and tilt (TILTING) fixture of the way, corresponds to the bottom of the fill liquid characteristics of the system; 
 - For repetitive tasks in high-speed point coating, wire coating equipment (PALLET functions); 
 - 2 X1, X2,-axis the SLIDE structure, high production efficiency.